Mentor Graphics PADS 9.5 x86/x64
PADS, Mentor Graphics world-leading desktop PCB design tool, enables you to develop PCBs within a highly productive, scalable, and easy-to-use environment. We recommend the following memory, disk space, and processor speed for reasonable performance of PADS software. Note that performance may be impacted by the complexity of your design and by the number of concurrent processes. PC hardware: Pentium IV: 2 + GHz recommended Three-button mouse or wheel mouse recommended (two-button mouse minimum) 1024 x 768, 256 color display, minimum Operating systems: Microsoft Windows XP Professional (service pack 2) Or Microsoft Vista NOTE: Windows 2000 is no longer supported. Memory recommendations: Windows Vista Ultimate or Business Editions: 2GB memory or higher. Windows XP Professional (sp2): 1 GB memory or higher. 512MB minimum. For full installation, 2.5 GB space is recommended. (500 MB minimum for installing only PADS Logic, PADS Layout, PADS Router, and HyperLynx) Note: You must have Internet Explorer version 6.0 or higher installed for certain components of PADS software to operate correctly. Warnings: PADS2007 (and higher) does not support operating systems that are run in VMWare sessions. Using this type of setup can cause PADS2007 to function incorrectly during and after installation. Issue Date: October 2012 Version: 9.5 Developer: MENTOR GRAPHICS Bit depth: 32bit +64 bit Compatibility with Vista: complete Compatible with Windows 7: complete Language: English Medicine: Present
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Monday, October 28, 2013
Mentor Graphics PADS 9.5 x86/x64
Mentor Graphics FloTHERM XT 1.1Build 13.1.3-SolidSQUAD (64bit)
Mentor Graphics FloTHERM XT 1.1Build 13.1.3-SolidSQUAD (64bit)
| 2.41 Gb
Mentor Graphics Corporation announced the FloTHERM® XT software that enables the industry's first integrated MDA-EDA electronics cooling simulation solution--from conceptual through detailed design--to dramatically shorten the process.
This solution addresses two of today's trends which are electronic challenges and geometric complexity. The electronic challenges are driven by increasing speed, density, and power consumption of ICs, PCBs and electronic systems. The increasing geometric complexity is driven by decreasing size and the increased influence of industrial design which requires handling of complex shapes. The FloTHERM XT technology efficiently interconnects mechanical design automation (MDA) and electronic design automation (EDA) domains and addresses the needs of design engineers as well as thermal specialists.
This electronics cooling simulation solution enables earlier virtual prototyping, fewer design iterations, and advanced "what-if" analysis for improved product quality and faster time-to-market benefits. Key markets where the FloTHERM XT product can benefit design teams from components to systems of electronic applications are industries such as automotive, aerospace, telecommunications, computing, industrial automation and consumer electronics.
Combining the electronics cooling DNA from the Mentor Graphics® Corporation's market-leading FloTHERM® thermal analysis software, and Concurrent Computational Fluid Dynamic (Concurrent CFD) technology from the FloEFDT product, the FloTHERM XT solution offers the power and performance to solve complex electronics systems design problems. The product's easy-to-use interface is fully configurable so new users can customize the functionality features on the screen, providing a scalable user experience that can be adapted as the needs of the design project change.
Imported or CAD-generated geometries work seamlessly with the FloTHERM XT's SmartPart library of models, and automatic meshing and data convergence provide significant reduction in execution times. It also provides an easy and intuitive direct interface to enterprise platforms such as the market-leading Mentor Expedition® Enterprise solution. The direct integration of the FloTHERM XT product with PCB design flows will reduce time-consuming data translation and costly errors. As a result, FloTHERM XT is the only solution on the market that allows engineers to work effortlessly with geometry created in the MDA or EDA world.
Name: Mentor Graphics FloTHERM XT
Version: (64bit) 1.1 build 13.1.3
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Mentor Graphics Expedition Enterprise Flow Ee v7.9.4 And Dms v7.9.4 | 2.567 GB
Mentor Graphics Expedition Enterprise Flow Ee v7.9.4 And Dms v7.9.4 | 2.567 GB
Designing a product requires more than a simple high PCB you need PCB design software tightly integrated. Expedition Enterprise provides this high level of integration, enabling all team members to work collaboratively and more efficiently.
Sophisticated systems design companies today seek to find areas in which to maximize product differentiation and profitability. With the right tools, these strategic advantages can be achieved in the process of PCB design.
Mentor Graphics Expedition Enterprise design flow is the most innovative PCB industry, providing an integration of the definition of the design of manufacturing execution system. Its unique and patented technologies can reduce design cycles by 50% or more, while significantly improving the overall quality and efficiency of resources.
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Mentor Graphics Modelsim SE 10.1c English | 707 MB
Mentor Graphics Modelsim SE 10.1c English | 707 MB
The system of digital simulation projects based on VHDL, Verilog and "mixed" descriptions with built-in performance analysis, indicating "active" code (code coverage), the comparator time diagrams and visualizer Enhanced Dataflow Window. Main features: high speed simulation for RTL and Gate projects; single simulator kernel and optimized architecture Native Compiled; interactive debugging and analysis with a module Debug Detective; integrated analysis of Code Coverage; optimization of simulation speed by using the Performance Analyzer Performance Analyzer; comprehensive tracing signals Signal Spy; integrated debugger C, C and interfaces support
Tcl / Tk; support for OS Unix / Windows / Linux.
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Mentor Graphics HDL Designer 2012.1 x86 | 377 MB
Mentor Graphics HDL Designer 2012.1 x86 | 377 MB
HDL Designer is a powerful development environment for HDL. The product combines tools for in-depth analysis, advanced editors, and complete control of the process of project development, which improves the performance of both individual developers and teams, as well as to increase the predictability of the outcome.
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Cadence SPB OrCAD 16.60.018 Hotfix | 873.2 MB
Cadence SPB OrCAD 16.60.018 Hotfix | 873.2 MB
Cadence Design Systems, Inc. announce hotfix version 018 for 16.60 release. This update includes some critical bug fixes.
Cadence Design Systems, Inc., a leader in global
electronic design innovation, launched the Cadence OrCAD 16.6 design
solution with new features, enhanced customization capabilities, and 20
percent simulation performance improvements that provide customers a
shorter, more predictable path to product creation.
This latest release offers numerous improvements to tool usability and performance, but at the heart of 16.6 are three key benefits: enhanced miniaturization capabilities, timing-aware physical implementation and verification for faster timing closure, and the industry’s first electrical CAD team collaboration environment for PCB design using Microsoft SharePoint technology.
A hot fix is a software maintenance package containing a small number of code fixes, designed to fix a sall number of critical problems. A hot fix enables a customer to receive fixes for urgent problems, without having to wait for the next service pack.
Each successive Fix Pack is comprehensive and contains the material from the earlier Fix Packs for that Release, as well as all Interim Fixes made available since the previous Fix Pack or full Release. In other words, when multiple Fix Packs are available, you would not need to apply Fix Pack 1 before applying Fix Pack 2.
DATE: 10-25-2013 HOTFIX VERSION: 018
=====================================================================================
CCRID PRODUCT PRODUCTLEVEL2 TITLE
======================================================================================
1118303 CONCEPT_HDL CONSTRAINT_MGR can not prdefine default units in HDL
1174901 ALLEGRO_EDITOR GRAPHICS Spurious odd lines are shown in shapes and text that are not part of the design with opengl
1176990 CONCEPT_HDL OTHER DEHDL BOM tool doesn?t see similar names.
1179665 GRE CORE Plan Topological Crashes after around 8 hours of routing.
1188193 CONCEPT_HDL CHECKPLUS CheckPlus not recognizing PIN as a base object.
1189100 SCM OTHER Replace part in SCM using ADW as library fails
1189507 SCM SCHGEN ERROR(SPCOCN-2009): Package error after second schgen run with Preserve mode.
1192391 CONSTRAINT_MGR CONCEPT_HDL Restore from definition deletes local objects in other blocks
1194597 FSP OTHER Pin definition problem
1195202 SIP_LAYOUT LEFDEF_IF Cannot add .lef files in IC Library Manager. Getting warning message WARNING(SPMHLD-52)
1195309 GRE CORE GRE crashing during Plan Spatial.
1197262 ALLEGRO_EDITOR MANUFACT Angular Dimension created in symbol is placed w.r.t. board origin and angle is blank
1198521 CONCEPT_HDL OTHER Cadence DEHDL issue - Note for Hotfix_SPB16.60.016_wint_1of1
1199219 ALLEGRO_EDITOR INTERFACES Question on STEP Model export which uses PLACE_BOUND layer for any symbols that do not have STEP model mapped
1199235 ALLEGRO_EDITOR SCHEM_FTB capture's behavior is redundant while creating pcb editor netlist
1199323 GRE IFP_INTERACTIVE Crash when importing logic
1199368 SIP_LAYOUT DIE_EDITOR Refresh of die abstract in die editor with this design takes over two hours
1199760 ALLEGRO_EDITOR DATABASE Allegr won't display Soldermask Top layer
About Cadence Design Systems, Inc.
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.
Name: Cadence SPB OrCAD
Version: (32bit) 16.60.018 Hotfix
Home: www.cadence.com
Interface: english
OS: Windows XP / Vista / Seven
System Requirements: Cadence SPB OrCAD 16.60.000 - 16.60.017
Size: 873.2 mb
This latest release offers numerous improvements to tool usability and performance, but at the heart of 16.6 are three key benefits: enhanced miniaturization capabilities, timing-aware physical implementation and verification for faster timing closure, and the industry’s first electrical CAD team collaboration environment for PCB design using Microsoft SharePoint technology.
A hot fix is a software maintenance package containing a small number of code fixes, designed to fix a sall number of critical problems. A hot fix enables a customer to receive fixes for urgent problems, without having to wait for the next service pack.
Each successive Fix Pack is comprehensive and contains the material from the earlier Fix Packs for that Release, as well as all Interim Fixes made available since the previous Fix Pack or full Release. In other words, when multiple Fix Packs are available, you would not need to apply Fix Pack 1 before applying Fix Pack 2.
DATE: 10-25-2013 HOTFIX VERSION: 018
=====================================================================================
CCRID PRODUCT PRODUCTLEVEL2 TITLE
======================================================================================
1118303 CONCEPT_HDL CONSTRAINT_MGR can not prdefine default units in HDL
1174901 ALLEGRO_EDITOR GRAPHICS Spurious odd lines are shown in shapes and text that are not part of the design with opengl
1176990 CONCEPT_HDL OTHER DEHDL BOM tool doesn?t see similar names.
1179665 GRE CORE Plan Topological Crashes after around 8 hours of routing.
1188193 CONCEPT_HDL CHECKPLUS CheckPlus not recognizing PIN as a base object.
1189100 SCM OTHER Replace part in SCM using ADW as library fails
1189507 SCM SCHGEN ERROR(SPCOCN-2009): Package error after second schgen run with Preserve mode.
1192391 CONSTRAINT_MGR CONCEPT_HDL Restore from definition deletes local objects in other blocks
1194597 FSP OTHER Pin definition problem
1195202 SIP_LAYOUT LEFDEF_IF Cannot add .lef files in IC Library Manager. Getting warning message WARNING(SPMHLD-52)
1195309 GRE CORE GRE crashing during Plan Spatial.
1197262 ALLEGRO_EDITOR MANUFACT Angular Dimension created in symbol is placed w.r.t. board origin and angle is blank
1198521 CONCEPT_HDL OTHER Cadence DEHDL issue - Note for Hotfix_SPB16.60.016_wint_1of1
1199219 ALLEGRO_EDITOR INTERFACES Question on STEP Model export which uses PLACE_BOUND layer for any symbols that do not have STEP model mapped
1199235 ALLEGRO_EDITOR SCHEM_FTB capture's behavior is redundant while creating pcb editor netlist
1199323 GRE IFP_INTERACTIVE Crash when importing logic
1199368 SIP_LAYOUT DIE_EDITOR Refresh of die abstract in die editor with this design takes over two hours
1199760 ALLEGRO_EDITOR DATABASE Allegr won't display Soldermask Top layer
About Cadence Design Systems, Inc.
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.
Name: Cadence SPB OrCAD
Version: (32bit) 16.60.018 Hotfix
Home: www.cadence.com
Interface: english
OS: Windows XP / Vista / Seven
System Requirements: Cadence SPB OrCAD 16.60.000 - 16.60.017
Size: 873.2 mb
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